2016 International Conference on Solid State Devices and Materials
Sep 26, 2016 - Sep 29, 2016 Tsukuba International Congress Center, Tsukuba, Japan
11:24 AM - 11:27 AM
[PS-2-09] Physical Surface Treatments for Improving Direct Copper Bonding
P. H. Chiang1,○S. Y. Liang1, J. M. Song1, S. K. Huang2, Y. T. Chiu2, C. P. Hung2 (1.National Chung Hsing Univ.(Taiwan), 2.Advanced Semiconductor Engineering Group(Taiwan))
