1:30 PM - 2:00 PM [H-1-01 (Invited)] Nanocarbon application including interconnects and thermal interface materials ○D. Kondo1, S. Sato1, T. Iwai1, N. Yokoyama1 (1.Fujitsu Labs. Ltd. (Japan)) https://doi.org/10.7567/SSDM.2017.H-1-01