13:30 〜 14:00

[H-1-01 (Invited)] Nanocarbon application including interconnects and thermal interface materials

^○D. Kondo¹, S. Sato¹, T. Iwai¹, N. Yokoyama¹ (1.Fujitsu Labs. Ltd. (Japan))

https://doi.org/10.7567/SSDM.2017.H-1-01