09:30 〜 10:00

[H-3-01 (Invited)] Effect of Metallization on the Microstructural Evolution of Microbump under Electric Current Stressing

C. -W. Chen¹,^○K. -L. Lin¹ (1.National Cheng Kung Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2017.H-3-01