The Japan Society of Applied Physics

10:00 〜 10:20

[H-3-02] Enhancement of Direct Cu Bonding via Pulsed Flash Light

J. -M. Song1, S. -Y. Liang1, P. -H. Chiang1, S. -K. Huang2, Y. -T. Chiu2, D. Tarng2, C. -P. Hung2 (1.National Chung Hsing Univ. (Taiwan), 2.Advanced Semiconductor Engineering Group (Taiwan))

https://doi.org/10.7567/SSDM.2017.H-3-02