10:00 〜 10:20

[H-3-02] Enhancement of Direct Cu Bonding via Pulsed Flash Light

^○J. -M. Song¹, S. -Y. Liang¹, P. -H. Chiang¹, S. -K. Huang², Y. -T. Chiu², D. Tarng², C. -P. Hung² (1.National Chung Hsing Univ. (Taiwan), 2.Advanced Semiconductor Engineering Group (Taiwan))

https://doi.org/10.7567/SSDM.2017.H-3-02