10:20 〜 10:40

[H-3-03] Low Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration

^○T. -C. Chou¹ (1.National Chiao Tung Univ. (Taiwan))

https://doi.org/10.7567/SSDM.2017.H-3-03