The Japan Society of Applied Physics

14:00 〜 14:20

[H-4-01] Impacts of annealing on interfaces of Al foil/Si junctions by using surface activated bonding

K. Furuna1, J. Liang1, M. Matsubara2, D. Marwan2, Y. Nishio2, N. Shigekawa1 (1.Osaka City Univ. (Japan), 2.Toyo Aluminium K.K. (Japan))

https://doi.org/10.7567/SSDM.2017.H-4-01