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[H-4-01] Impacts of annealing on interfaces of Al foil/Si junctions by using surface activated bonding

^○K. Furuna¹, J. Liang¹, M. Matsubara², D. Marwan², Y. Nishio², N. Shigekawa¹ (1.Osaka City Univ. (Japan), 2.Toyo Aluminium K.K. (Japan))

https://doi.org/10.7567/SSDM.2017.H-4-01