15:20 〜 15:35

[H-4-05 (Late News)] Au thin film wafer bonding after degas annealing for MEMS packaging

^○T. Matsumae¹, Y. Kurashima¹, H. Takagi¹ (1.AIST (Japan))

https://doi.org/10.7567/SSDM.2017.H-4-05