11:15 〜 11:45

[H-6-01 (Invited)] Heterogeneous Integration Based on Low-Temperature Bonding for Advanced Optoelectronic Devices

^○E. Higurashi^1,2 (1.AIST (Japan), 2.Univ. of Tokyo (Japan))

https://doi.org/10.7567/SSDM.2017.H-6-01