1:55 PM - 2:10 PM

[J-7-02 (Late News)] Enlarging the Nanocylinder Size for Through-Si-Via Applications

^○M. Mariappan¹, T. Fukushima¹, K. Mori¹, J. Bea¹, H. Hashimoto¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2017.J-7-02