[PS-14-08] High Temperature SiC Power Module Enhanced with Transient Thermal Characteristic by Al-bump Technology

^○H. Tanisawa^1,2, F. Kato¹, K. Koui^1,3, S. Sato¹, K. Watanabe¹, H. Takahashi^1,4, Y. Murakami^1,5, H. Sato¹ (1.AIST (Japan), 2.Sanken electric Corp., Ltd. (Japan), 3.Calsonic Kansei Corp. (Japan), 4.Fuji Electric Co., Ltd. (Japan), 5.NISSAN MOTOR Corp., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2017.PS-14-08