The Japan Society of Applied Physics

[PS-14-08] High Temperature SiC Power Module Enhanced with Transient Thermal Characteristic by Al-bump Technology

H. Tanisawa1,2, F. Kato1, K. Koui1,3, S. Sato1, K. Watanabe1, H. Takahashi1,4, Y. Murakami1,5, H. Sato1 (1.AIST (Japan), 2.Sanken electric Corp., Ltd. (Japan), 3.Calsonic Kansei Corp. (Japan), 4.Fuji Electric Co., Ltd. (Japan), 5.NISSAN MOTOR Corp., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2017.PS-14-08