[PS-2-01] Performance of WCN Diffusion Barrier for Cu Through Silicon Vias

Y. T. Kim¹,^○S. Lee^2,1, B. Ju² (1.Korea Inst. of Sci. and Tech. (Korea), 2.Korea Univ. (Korea))

https://doi.org/10.7567/SSDM.2017.PS-2-01