Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub micron thick heat spreading materials

[PS-2-06] Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub micron thick heat spreading materials

^○C. H. Kumar¹, A. K. Panigrahi¹, P. Supraja¹, N. Paul¹, S. G. Singh¹ (1.Indian Inst. of Tech. -Hyderabad (India))