Investigation of Transient Thermal Dissipation in Three-Dimensional Stacked ICs

2017 International Conference on Solid State Devices and Materials

Sep 19, 2017 - Sep 22, 2017
Sendai International Center

11:47 AM - 11:49 AM

^○Y. Araga¹, H. Shimamoto¹, S. Melamed¹, K. Kikuchi¹, M. Aoyagi¹ (1.AIST (Japan))