Damage mechanism of GaN/DBA die-attach module with Ag sinter paste by thermal shock

D. Kim

doi:https://doi.org/10.7567/SSDM.2018.D-7-03

9:45 AM - 10:00 AM

[D-7-03] Damage mechanism of GaN/DBA die-attach module with Ag sinter paste by thermal shock

^○D. Kim¹, C. Chen¹, C. Pei², Z. Zhang¹, S. Nagao¹, A. Suetake¹, T. Sugahara¹, K. Suganuma¹ (1.ISIR, Osaka univ. (Japan), 2.Academy of Electronics and Info.,Tech. (China))

https://doi.org/10.7567/SSDM.2018.D-7-03

2018 International Conference on Solid State Devices and Materials

[D-7-03] Damage mechanism of GaN/DBA die-attach module with Ag sinter paste by thermal shock