The Japan Society of Applied Physics

14:30 〜 14:45

[G-1-02] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement

Y. Luo1, K. Suzuki2, H. Miura2 (1.Department of Finemechanics, Graduate School of Engineering, Tohoku University (Japan), 2.Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University (Japan))

https://doi.org/10.7567/SSDM.2018.G-1-02