Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement

Y. Luo

doi:https://doi.org/10.7567/SSDM.2018.G-1-02

14:30 〜 14:45

[G-1-02] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement

^○Y. Luo¹, K. Suzuki², H. Miura² (1.Department of Finemechanics, Graduate School of Engineering, Tohoku University (Japan), 2.Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University (Japan))

https://doi.org/10.7567/SSDM.2018.G-1-02

2018 International Conference on Solid State Devices and Materials

[G-1-02] Evaluation of the Grain and Grain Boundary Strength in Copper Interconnections Based on the Order of Atom Arrangement