Temperature and Humidity Accelerations to Establish Lifetime Prediction Model for Cu-based Metallization

P. Gomasang

doi:https://doi.org/10.7567/SSDM.2018.G-1-03

14:45 〜 15:00

[G-1-03] Temperature and Humidity Accelerations to Establish Lifetime Prediction Model for Cu-based Metallization

^○P. Gomasang¹, S. Ogiue¹, S. Yokogawa², K. Ueno^1,3 (1.Shibaura Inst. of Tech. (Japan), 2.The Univ. of Electro-communication (Japan), 3.SIT Res. Ctr. for Green Innov. (Japan))

https://doi.org/10.7567/SSDM.2018.G-1-03

2018 International Conference on Solid State Devices and Materials

[G-1-03] Temperature and Humidity Accelerations to Establish Lifetime Prediction Model for Cu-based Metallization