3:00 PM - 3:15 PM

[G-1-04] Electromigration Behavior of Cu/SiCN to Cu/SiCN Hybrid Bonds for 3D Integrated Circuits

^○J. De Messemaeker¹, S.-W. Kim¹, M. Stucchi¹, G. Beyer¹, E. Beyne¹, K. Croes¹ (1.imec (Belgium))

https://doi.org/10.7567/SSDM.2018.G-1-04