Effect of Electroplating on Adhesion between Copper/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications

Y.L. Yang

doi:https://doi.org/10.7567/SSDM.2018.G-4-03

11:15 AM - 11:30 AM

[G-4-02] Effect of Electroplating on Adhesion between Copper/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications

^○Y.L. Yang¹, C.H. Lu¹, Y.P. Chen², C.P. Chen², T.T. Hung², C.F. Chen², K.N. Chen¹ (1.National Chiao Tung Univ. (Taiwan), 2.Taiflex Scientific Corp. (Taiwan))

https://doi.org/10.7567/SSDM.2018.G-4-03

2018 International Conference on Solid State Devices and Materials

[G-4-02] Effect of Electroplating on Adhesion between Copper/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications