Electrodeposition of High Strength Au-Cu Alloys for MEMS Device

T.F.M. Chang

doi:https://doi.org/10.7567/SSDM.2018.G-7-02

9:30 AM - 9:45 AM

[G-7-02] Electrodeposition of High Strength Au-Cu Alloys for MEMS Device

^○T.F.M. Chang¹, H. Tang¹, K. Nitta¹, C.Y. Chen¹, T. Nagoshi², D. Yamane¹, T. Konishi³, K. Machida¹, K. Masu¹, M. Sone¹ (1.Tokyo Tech (Japan), 2.AIST (Japan), 3.NTT AT (Japan))

https://doi.org/10.7567/SSDM.2018.G-7-02

2018 International Conference on Solid State Devices and Materials

[G-7-02] Electrodeposition of High Strength Au-Cu Alloys for MEMS Device