Gas Phase Pore Stuffing for Damage Mitigation during Plasma Etching

T. Yamaguchi

doi:https://doi.org/10.7567/SSDM.2018.PS-3-11

11:00 AM - 1:30 PM

[PS-3-11 (Late News)] Gas Phase Pore Stuffing for Damage Mitigation during Plasma Etching

^○T. Yamaguchi¹, S. Nozawa¹, M. Fujikawa¹, J.-F. de Marneffe², R. Chanson², K.B. Gavan², A. Rezvanov², Fr. Lazzarino² (1.Tokyo Electron Tchnology Solutions Ltd. (Japan), 2.Imec v.z.w. (Belgium))

https://doi.org/10.7567/SSDM.2018.PS-3-11

2018 International Conference on Solid State Devices and Materials

[PS-3-11 (Late News)] Gas Phase Pore Stuffing for Damage Mitigation during Plasma Etching