Thermionic cooling device based on asymmetric double-barrier heterostructure

A. Yangui

doi:https://doi.org/10.7567/SSDM.2018.PS-5-12

11:00 〜 13:30

[PS-5-12] Thermionic cooling device based on asymmetric double-barrier heterostructure

^○A. Yangui^1,2, M. Bescond^1,2, T. Yan¹, N. Nagai¹, K. Hirakawa^3,2,1 (1.Institute of Industrial Science, The University of Tokyo (Japan), 2.LIMMS/CNRS-IIS, UMI 2820 (Japan), 3.INQIE, The University of Tokyo (Japan))

https://doi.org/10.7567/SSDM.2018.PS-5-12

2018 International Conference on Solid State Devices and Materials

[PS-5-12] Thermionic cooling device based on asymmetric double-barrier heterostructure