The Japan Society of Applied Physics

16:15 〜 16:30

[J-2-02 (Late News)] Impact of Seed Layers on TSV Filling by Electrochemical Deposition

Y. Hara1, E. Webb1, J. Sukamto1, M. Mariappan2, T. Fukushima2, M. Kodera3 (1.Moses Lake Indus.-Advanced Res. Center (USA), 2.GINTI, NICHe, Tohoku Univ. (Japan), 3.Moses Lake Indus. Inc. (USA))

https://doi.org/10.7567/SSDM.2019.J-2-02