Impact of Seed Layers on TSV Filling by Electrochemical Deposition

Y. Hara

doi:https://doi.org/10.7567/SSDM.2019.J-2-02

4:15 PM - 4:30 PM

[J-2-02 (Late News)] Impact of Seed Layers on TSV Filling by Electrochemical Deposition

^○Y. Hara¹, E. Webb¹, J. Sukamto¹, M. Mariappan², T. Fukushima², M. Kodera³ (1.Moses Lake Indus.-Advanced Res. Center (USA), 2.GINTI, NICHe, Tohoku Univ. (Japan), 3.Moses Lake Indus. Inc. (USA))

https://doi.org/10.7567/SSDM.2019.J-2-02

2019 International Conference on Solid State Devices and Materials

[J-2-02 (Late News)] Impact of Seed Layers on TSV Filling by Electrochemical Deposition