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[J-5-04] Development of Electret made of SiO₂ Thin Film with Micro Bump Array to Avoid Electrostatic Stiction and Enhance Its Surface Potential

^○M. Suzuki¹, Y. Onishi¹, T. Takahashi¹, S. Aoyagi¹ (1.Kansai Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.J-5-04