Metallization Technology for High Current Density and High Temperature Operation Power Modules

K. Sugiura

doi:https://doi.org/10.7567/SSDM.2019.J-6-01

10:30 〜 11:00

[J-6-01 (Invited)] Metallization Technology for High Current Density and High Temperature Operation Power Modules

^○K. Sugiura¹, T. Iwashige¹, K. Tsuruta¹, Y. Sakuma², Y. Oda³, C. Chen⁴, S. Nagao⁴, T. Sugahara⁴, K. Suganuma⁴ (1.DENSO CORP. (Japan), 2.C.Uyemura & Co.,Ltd., Techinical Support Group (Japan), 3.C.Uyemura & Co.,Ltd., Central Research Lab. (Japan), 4.Osaka Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.J-6-01

2019 International Conference on Solid State Devices and Materials

[J-6-01 (Invited)] Metallization Technology for High Current Density and High Temperature Operation Power Modules