09:45 〜 10:00

[M-3-03] 2.5D Integration Using Inductive-Coupling TSV-less Miniature Interposer Achieving 317Gb/s/mm², 1.2pJ/b Data Transfer

^○C. Cheng¹, K. Shiba¹, M. Hamada¹, T. Kuroda¹ (1.Keio Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.M-3-03