Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF<sub>4</sub> Plasma Treatment

1:00 PM - 3:00 PM

[PS-3-03] Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF₄ Plasma Treatment

^○P. Gomasang¹, K. Ueno^1,2 (1.Shibaura Inst. of Tech. (Japan), 2.SIT Res. Center for Green Innov. (Japan))