13:00 〜 15:00

[PS-3-05 (Late News)] Chip-to-Wafer Gang Bonding for High Throughput 3D-Integration

^○M. Mariappan¹, T. Fukushima¹, A. Nakamura¹, J.C. Bea¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.PS-3-05