Efficient Heat Transfer by Through Silicon Via in 3D Packaging for Practical-scale Quantum Annealing Machine

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[PS-9-18 (Late News)] Efficient Heat Transfer by Through Silicon Via in 3D Packaging for Practical-scale Quantum Annealing Machine

^○W. Feng¹, K. Kikuchi¹, M. Hidaka¹, H. Yamamori¹, Y. Araga¹, K. Makise¹, S. Kawabata¹ (1.AIST (Japan))