1:00 PM - 3:00 PM

[PS-9-18 (Late News)] Efficient Heat Transfer by Through Silicon Via in 3D Packaging for Practical-scale Quantum Annealing Machine

^○W. Feng¹, K. Kikuchi¹, M. Hidaka¹, H. Yamamori¹, Y. Araga¹, K. Makise¹, S. Kawabata¹ (1.AIST (Japan))

https://doi.org/10.7567/SSDM.2019.PS-9-18