10:49 AM - 10:51 AM [PS-3-03] Amorphous-Carbon Barrier against Moisture for Copper Metallization and Effects of CF4 Plasma Treatment ○P. Gomasang1, K. Ueno1,2 (1.Shibaura Inst. of Tech. (Japan), 2.SIT Res. Center for Green Innov. (Japan))
