The Japan Society of Applied Physics

14:30 〜 14:45

[C-1-02] Development of Functional Interposer Using Bumpless Chip-on-Wafer
- Feasibility Study of Voidless Bonding with Thin Adhesive -

〇Yoshiaki Satake1,2, Tatsuya Funaki1,2, Kazuhiro Tabata1,2, Kyosuke Kobinata1,3, Young Suk Kim1,3, Takayuki Ohba1 (1. WOW Alliance, Tokyo Institute of Technology(Japan), 2. Murata Manufacturing Co.,Ltd.(Japan), 3. DISCO Corp.(Japan))

https://doi.org/10.7567/SSDM.2020.C-1-02