Development of Functional Interposer Using Bumpless Chip-on-Wafer<br />- Feasibility Study of Voidless Bonding with Thin Adhesive -

Yoshiaki Satake

doi:https://doi.org/10.7567/SSDM.2020.C-1-02

14:30 〜 14:45

[C-1-02] Development of Functional Interposer Using Bumpless Chip-on-Wafer
- Feasibility Study of Voidless Bonding with Thin Adhesive -

〇Yoshiaki Satake^1,2, Tatsuya Funaki^1,2, Kazuhiro Tabata^1,2, Kyosuke Kobinata^1,3, Young Suk Kim^1,3, Takayuki Ohba¹ (1. WOW Alliance, Tokyo Institute of Technology(Japan), 2. Murata Manufacturing Co.,Ltd.(Japan), 3. DISCO Corp.(Japan))

https://doi.org/10.7567/SSDM.2020.C-1-02

2020 International Conference on Solid State Devices and Materials

[C-1-02] Development of Functional Interposer Using Bumpless Chip-on-Wafer- Feasibility Study of Voidless Bonding with Thin Adhesive -

[C-1-02] Development of Functional Interposer Using Bumpless Chip-on-Wafer
- Feasibility Study of Voidless Bonding with Thin Adhesive -