Analysis and Optimization of Corner Effect of TSV Array in 3D Integrated Circuits

Yingwei An

doi:https://doi.org/10.7567/SSDM.2020.C-2-02

16:15 〜 16:30

[C-2-02] Analysis and Optimization of Corner Effect of TSV Array in 3D Integrated Circuits

〇Yingwei An¹, Xiaoxia Sun³, Yudi Zhao^1,2, Min Miao^1,2, Kai Zhao^1,2 (1. Info. Sci. and Tech. Univ. of Beijing(China), 2. Peking Univ.(China), 3. Labor Relations Univ. of China(China))

https://doi.org/10.7567/SSDM.2020.C-2-02

2020 International Conference on Solid State Devices and Materials

[C-2-02] Analysis and Optimization of Corner Effect of TSV Array in 3D Integrated Circuits