Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

Sandeep Seema Saseendran

doi:https://doi.org/10.7567/SSDM.2020.C-2-05

17:00 〜 17:15

[C-2-05 (Late News)] Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

〇Sandeep Seema Saseendran¹, Abhilash Paneri¹, Bert Tobback¹, Bogumila Kutrzeba-Kotowska¹, Emma Vecchio¹, Geraldine Jamieson¹, Vasile Paraschiv¹, Hyo Seon Suh¹, Bruno Figeys¹, Masaki Fujikane², Atsushi Himeno², Kunihiko Nakamura², Naoki Tambo², Yuki Nakata², Hiroyuki Tanaka², Yasuyuki Naito², Kouhei Takahashi², Deniz S Tezcan¹ (1. IMEC vzw(Belgium), 2. Panasonic Corporation(Japan))

https://doi.org/10.7567/SSDM.2020.C-2-05

2020 International Conference on Solid State Devices and Materials

[C-2-05 (Late News)] Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices