Cooling Measurement of On-Chip Inetgrated EOF Micropump Using CMOS-LSI Components

Yuki Okamoto

doi:https://doi.org/10.7567/SSDM.2020.C-2-06

5:15 PM - 5:30 PM

[C-2-06 (Late News)] Cooling Measurement of On-Chip Inetgrated EOF Micropump Using CMOS-LSI Components

〇Yuki Okamoto^1,2, Yoshio Mita², Hiroyuki Ryoson³, Takayuki Ohba³ (1. National Institute of Advanced Industrial Science and Technology(Japan), 2. The University of Tokyo(Japan), 3. Tokyo Institute of Technology(Japan))

https://doi.org/10.7567/SSDM.2020.C-2-06

2020 International Conference on Solid State Devices and Materials

[C-2-06 (Late News)] Cooling Measurement of On-Chip Inetgrated EOF Micropump Using CMOS-LSI Components