11:45 〜 12:00

[C-4-03] Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) Technologywith 3D-manner Redundancy Scheme

〇Shinji Sugatani¹, Norio Chujo¹, Koji Sakui¹, Hiroyuki Ryoson¹, Tomoji Nakamura¹, Takayuki Ohba¹ (1. Tokyo Institute of Technology(Japan))

https://doi.org/10.7567/SSDM.2020.C-4-03