12:00 〜 12:15

[C-4-04] Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration

〇Shuai Liu¹, Kousei Kumahara¹, Yuki Miwa¹, Hisashi Kino¹, Tetsu Tanaka¹, Takafumi Fukushima¹ (1. Tohoku Univ.(Japan))

https://doi.org/10.7567/SSDM.2020.C-4-04