4:30 PM - 4:45 PM

[C-6-02] Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave/SpO₂ Monitoring

〇Tomo Odashima¹, Yuki Susumago¹, Qian Zhengyang¹, Noriyuki Takahashi², Shuta Nagata¹, Hisashi Kino³, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1. Univ. of Tohoku, Mechanical Systems Engineering(Japan), 2. Univ. of Tohoku, Biomedical Engineering(Japan), 3. Univ. of Tohoku, Frontier Research Institute for Interdisciplinary Sciences(Japan))

https://doi.org/10.7567/SSDM.2020.C-6-02