An Inverted T-shaped MEMS Capacitive Pressure Sensor<br />with Multiple-Diaphragm Anchor and On-chip Temperature Sensor

Yoshihiko Kurui

doi:https://doi.org/10.7567/SSDM.2020.C-9-03

14:45 〜 15:00

[C-9-03] An Inverted T-shaped MEMS Capacitive Pressure Sensor
with Multiple-Diaphragm Anchor and On-chip Temperature Sensor

Yoshihiko Kurui¹, Fumitaka Ishibashi¹, Kei Masunishi¹, Tomohiro Saito¹, Tomohiko Nagata¹, 〇Hiroaki Yamazaki¹, Naofumi Nakamura¹ (1. Corporate Research & Development Center, Toshiba Corporation(Japan))

https://doi.org/10.7567/SSDM.2020.C-9-03

2020 International Conference on Solid State Devices and Materials

[C-9-03] An Inverted T-shaped MEMS Capacitive Pressure Sensorwith Multiple-Diaphragm Anchor and On-chip Temperature Sensor

[C-9-03] An Inverted T-shaped MEMS Capacitive Pressure Sensor
with Multiple-Diaphragm Anchor and On-chip Temperature Sensor