Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication

Wei Feng, Haruo  Shimamoto, Tsuyoshi Kawagoe, Ichirou Honma, Masato Yamasaki, Fumitake Okutsu, Takatoshi Masuda, Katsuya Kikuchi

doi:https://doi.org/10.7567/SSDM.2021.C-4-02

11:15 AM - 11:22 AM

[C-4-02] Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication

〇Wei Feng¹, Haruo Shimamoto¹, Tsuyoshi Kawagoe², Ichirou Honma², Masato Yamasaki², Fumitake Okutsu², Takatoshi Masuda², Katsuya Kikuchi¹ (1.National Inst. of Advanced Indus. Sci. and Tech. (AIST), 2.UltraMemory Inc.)

https://doi.org/10.7567/SSDM.2021.C-4-02

2021 International Conference on Solid State Devices and Materials

[C-4-02] Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication