Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication

Wei Feng

doi:https://doi.org/10.7567/SSDM.2021.C-4-02

11:15 〜 11:22

[C-4-02] Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication

〇Wei Feng¹、Haruo Shimamoto¹、Tsuyoshi Kawagoe²、Ichirou Honma²、Masato Yamasaki²、Fumitake Okutsu²、Takatoshi Masuda²、Katsuya Kikuchi¹ (1.National Inst. of Advanced Indus. Sci. and Tech. (AIST)、2.UltraMemory Inc.)

https://doi.org/10.7567/SSDM.2021.C-4-02

2021 International Conference on Solid State Devices and Materials

[C-4-02] Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication