11:22 AM - 11:29 AM

[C-4-03] Wafer-Level Capillary Underfill Technology with Controlled Fillet Configuration for Multichip-to-Wafer 3D Integration

〇Shuai Liu¹, Aoba Onishi¹, Hisashi Kino¹, Takafumi Fukushima¹, Tetsu Tanaka¹ (1.Tohoku Univ.)

https://doi.org/10.7567/SSDM.2021.C-4-03