Wafer-Level Capillary Underfill Technology with Controlled Fillet Configuration for Multichip-to-Wafer 3D Integration

11:22 〜 11:29

[C-4-03] Wafer-Level Capillary Underfill Technology with Controlled Fillet Configuration for Multichip-to-Wafer 3D Integration

〇Shuai Liu¹、Aoba Onishi¹、Hisashi Kino¹、Takafumi Fukushima¹、Tetsu Tanaka¹ (1.Tohoku Univ.)