The Japan Society of Applied Physics

11:36 〜 11:43

[C-4-05] Experiments and Simulations of Ultrasonic Bonding for Al Bump Arrays

Pin-Kuan Li1、Hai-Wen Hung1、〇Yuan-Kuan Chen1、Wallace Chuang2、Eckart Schellkes2、Yasuda Kiyokazu3、Jenn-Ming Song1 (1.Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan、2..Automotive Electronics Department, Robert Bosch Taiwan Co., Ltd, Taipei 104, Taiwan、3.Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University Osaka, 565-0871 Japan)

https://doi.org/10.7567/SSDM.2021.C-4-05