11:36 〜 11:43

[C-4-05] Experiments and Simulations of Ultrasonic Bonding for Al Bump Arrays

Pin-Kuan Li¹、Hai-Wen Hung¹、〇Yuan-Kuan Chen¹、Wallace Chuang²、Eckart Schellkes²、Yasuda Kiyokazu³、Jenn-Ming Song¹ (1.Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan、2..Automotive Electronics Department, Robert Bosch Taiwan Co., Ltd, Taipei 104, Taiwan、3.Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University Osaka, 565-0871 Japan)

https://doi.org/10.7567/SSDM.2021.C-4-05